Capabilities / DIP Assembly

DIP Assembly

Dual wave-solder lines, hand soldering and box build.

Key specifications

Two independent wave-solder lines with hand-solder bays and an ICT/FCT test line enable finished-goods delivery.

4,000pcs/hr

Total throughput

2lines

Wave-solder lines

1,000pcs/hr

Test capacity

ICT+FCT

Test coverage

Process chain

Insertion

Wave solder

Hand solder

ICT/FCT

Pack & ship

Line capacity split

DIP-1

2,000

Wave + hand

DIP-2

2,000

Wave + hand

Test

1,000

ICT + FCT

01,0002,000

pcs/hr

FAQ

What is the DIP throughput?

4,000 pcs/hr across two wave-solder lines, with hand-solder bays.

Do you support box build?

Yes. Insertion, wave soldering, hand soldering, ICT/FCT and packing are all done in-house.

Is electrical testing performed after DIP?

Yes — a 1,000 pcs/hr test line covering ICT and functional test.

Other capabilities

Need a process-fit check?

Send your BOM and Gerber — engineers reply with a feasibility review within 1 business day.