Test & QC

7 inspection stages, full-chain test coverage.

Key specifications

From paste height to final solder joints, every stage is gated by dedicated equipment; records are archived per work order.

7stages

Inspection gates

2.5D

SPI paste height

100%

AOI coverage

100%

Outgoing coverage

Process chain

IQC

SPI

FAI

AOI

X-Ray

ICT/FCT

OQC

7 inspection gates and their equipment

IQC

Incoming QC Electrical & visual sampling

SPI

Paste inspection 2.5D paste height

FAI

First article Part-by-part verification

AOI

Optical inspection Pre & post reflow scan

X-RAY

Solder X-Ray Hidden BGA joint imaging

ICT/FCT

Electrical & functional In-circuit + functional

OQC

Outgoing QC Dimension & final visual

FAQ

What inspection equipment do you run?

SPI paste gauge, AOI JTA-600, X-Ray, ICT, FCT, 2D measuring, LCR meter and first-article tester.

Is AOI coverage 100%?

Yes — full AOI scan pre- and post-reflow, plus a final OQC check before shipment.

How are BGA joints verified?

Hidden BGA joints are inspected by X-Ray imaging; rework is verified by X-Ray plus functional test.

Other capabilities

Need a process-fit check?

Send your BOM and Gerber — engineers reply with a feasibility review within 1 business day.